Core Technology | 2020 | |||
---|---|---|---|---|
Mass Production | Sample | |||
Fine Pattern (Line/Space) |
Line/SpaceCu : 9um , 1/4oz | 35um/40um | 35um/35um | |
Etching Process | ||||
Via Hole | Via Size / Land | Through Hole | 100/250㎛ | |
Laser Via Hole | 90/240㎛ | |||
Impedance | Tolerance | ±10% | ||
FCCL | Copper Thickness | 1/4oz( ED / RA /HAV2 ) | ||
Layer Count | Multi-Layer / Rigid-Flex | 8 Layers / 10 Layers |
2021 | 2022 |
---|---|
30um/35um | 25um/25um |
New Process Etching Process |
New Process |
90/240㎛ | 90/220㎛ |
85/240㎛ | 75/220㎛ |
±10% | ±8% |
1/6oz | 0.1oz |
10 Layers / 12 Layers | 10 Layers / 14Layers |