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    Technology Roadmap

    FPCB Technology Roadmap

    Core Technology 2017
    Mass Production Sample
    Fine Pattern(Line/Space) Line/SpaceCu : 9um , 1/4oz 40um/35um 35um/35um
    Etching Process
    Via Hole Via Size / Land Through Hole 100/300㎛ 100/275㎛
    Laser Via Hole 75/275㎛ 75/275㎛
    Impedance Tolerance ±10% ±10%
    Material Low Dk FCCL 3.0 3.0
    Low Dk Bonding Sheet( 1GHz ) Normal (3.4) , Low Dk (3.0)
    FCCL Copper Thickness 1/4oz( ED / RA /HAV2 )
    Layer Count Multi-Layer / Rigid-Flex 8 Layers / 10 Layers
    2018 2019
    30um/30um 25um/25um
    Button Plating/Etching Process mSAP Method
    90/250㎛ 75/220㎛
    75/250㎛ 35/200㎛ (PTH)
    ±10% ±8%
    2.8 2.5
    2.4 2.15
    1/5oz 0.1oz
    10 Layers / 12 Layers 10 Layers / 14Layers

    SMT Technology Roadmap

    Core Technology 2017 2018 2019
    Solder mask Opening Connector Pitch 0.35mm 0.3mm 0.3mm
    Solder Paste Powder Size Type 5 (15~25um)
    Type 4 (25~38um)
    Type 5 (15~25um) New (10um under)
    Surface Mounter Minimum Component Size 0.4mm X 0.2mm (0402) 0.3mm X 0.15mm (03015) 0.3mm X 0.15mm (03015)
    Chip Absolute Tolerance ±50㎛ ±35㎛ ±35㎛
    Component Space 0.2mm 0.15mm 0.15mm