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    • R&D 정보

    R&D 정보

    Technology Roadmap

    Core Technology 2020
    Mass Production Sample
    Fine Pattern
    (Line/Space)
    Line/SpaceCu : 9um , 1/4oz 35um/40um 35um/35um
    Etching Process
    Via Hole Via Size / Land Through Hole 100/250㎛
    Laser Via Hole 90/240㎛
    Impedance Tolerance ±10%
    FCCL Copper Thickness 1/4oz( ED / RA /HAV2 )
    Layer Count Multi-Layer / Rigid-Flex 8 Layers / 10 Layers
    2021 2022
    30um/35um 25um/25um
    New Process
    Etching Process
    New Process
    90/240㎛ 90/220㎛
    85/240㎛ 75/220㎛
    ±10% ±8%
    1/6oz 0.1oz
    10 Layers / 12 Layers 10 Layers / 14Layers