BH的研发人员 凭借领先的技术实力,专注于新产品的开发及量产研究,
致力于改善BH的产品和服务。
Normal | |||||
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Mechanical Drill Normal Plating | Laser Via hole Normal Plating | Laser Via & Via on Via Via Fill Plating | |||
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Special | |||||
Though Hole Via Filling | Ultra Micro Via Normal & Via Filling | ||||
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Normal | |
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Mechanical Drill Normal Plating | |
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Laser Via hole Normal Plating | |
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Laser Via & Via on Via Via Fill Plating | |
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Special | |
Though Hole Via Filling | |
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Ultra Micro Via Normal & Via Filling | |
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※ Aspect Ratio
量产水平 |
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[ Tenting (Etching Process) ] |
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R&D |
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[ mSAP ( Modified Semi-additive Process) ] |
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ACF Bonder / PEEL / Plasma | 延伸率管理 |
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ACF Bonder / PEEL / Plasma |
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延伸率管理 |
设备平面图 | 设备Flow | |||
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自动投放 |
自动冲压 |
自动筛选 |
自动排放 |
设备平面图 | |||
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设备Flow | |||
自动投放 |
自动冲压 |
自动筛选 |
自动排放 |
量产水平 | |
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Land | 300㎛ |
Via | 100㎛ |
量产水平 | |
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Land | 75㎛ |
Via | 25㎛ |
BH R&D Technology : Landless FPC |
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类别 | Fine Pattern Min Line/Space(um) | Small Via & Pad Annual Ring(um) | SR Tolerance偏心公差(um) | a lot of Via Hole Hole数(EA/sqm) |
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Normal Application | 45/45 | 100 | 40 | 10~30만 |
Micro LED | 35/35↓ | 30↓ | 20 | 100↑ |
ETC |
类别 | Fine Pattern Min Line/Space(um) | Small Via & Pad Annual Ring(um) |
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Normal Application | 45/45 | 100 |
Micro LED | 35/35↓ | 30↓ |
ETC | ||
类别 | SR Tolerance偏心公差(um) | a lot of Via Hole Hole数(EA/sqm) |
Normal Application | 40 | 10~30만 |
Micro LED | 20 | 100↑ |
ETC |
Stretchable Test | |
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