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About Us

About Group Companies

Business description

R&D

Investment information

ESG management

Recruitment information

Business description

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BH PCBs are main boards that better integrate top technologies such as high density layer, fine pattern, and micro via compared to general PCBs, supporting high functionalization of electronic devices such as smart phones and tablet PCs.

  • Mobile

  • NoteBook

  • Tablet PC

Structure
Features and benefits
Stack via / All Stack via
  • Optimized vertical routing solution in one compact structure.
  • Simplifies trace routes between multiple layers.
  • Provides efficient connectivity integration for high-density PCBs by offering a compressed footprint and multi-layer reach
  • Via fill electrification provides superior reliability and electrical characteristics
  • Registered technology to prevent LVH tilting on each layer and ensure the high reliability required to prevent interfacial detachment.
Mechanical
  • Using BITs to machine PTH on the same point requires high machining precision.
  • Minimizes signal loss by forming an even electroplating layer.
  • High Aspect Ratio enables high capacity data transmission.
Edge Plating
  • Prevents electromagnetic waves from being emitted or leaked to the edge of the board.
  • Improves PCB EMC performance.
  • Provides superior signal integrity.
  • Heat dissipation and cooling.
  • Increases current carrying capacity.
Hole Plugging Print
  • Fill inner via holes with resin to ensure reliability against failure regarding shrinkage and expansion.
  • Integrated pad and via hole area for mounting elements.
Detailed specifications
Specification
No. of Layers 4~20L
Base Material(Laminate) FR-4, High Tg FR-4, Halogen Free
Base Material(Build up) FR-4, RCC, High Tg FR-4, Halogen Free, etc
Board Thickness 0.3~1.6T
Min.Line Width 30um
Min Line Spacing 40um
Min. Mech. Drill Size 150um
Min. Laser. Drill Size 80um
Surface Treatment ENIG, Immersion TIN, Selectve OSP
Comment Stack via, Staggered via, Filled via
Type PCS & KIT