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| Registration number | Registration date | Title of invention |
|---|---|---|
| 2138555 | July 22, 2020 | Coverlay of a circuit board with block division slots |
| 2066934 | January 10, 2020 | Bonding method using PEN FPCB and large-area PEN FPCB assembly manufactured using the same |
| 1953850 | February 25, 2019 | Manufacturing method of double side embedded |
| 1760668 | 2017-07-18 | Manufacturing method of embedded printed circuit board that can embed multiple electronic devices composed of different thicknesses |
| 1744247 | 2017-05-31 | Manufacturing method of embedded printed circuit boards |
| 1652232 | 2016-08-24 | Manufacturing method of fine pitch thin film FPCB using ALCU foil |
| 1596469 | 2016-02-16 | Automatic lamination machine for auxiliary materials for hot press process of flexible printed circuit boards |
| 1555673 | 2015-09-18 | Manufacturing method of flexible printed circuit boards |
| 1425580 | 2014-07-25 | Coverlay film adhesive bonding method using a carrier film |
| 1373330 | 2014-02-28 | Manufacturing method of FPCB using R.T.R exposure and slitting method |
25, Pyeongcheon-ro 199beon-gil, Bupyeong-gu, Incheon (Cheongcheon-dong) TEL : 032.510.2000 | FAX : 032-514-8677 | E-mail : bhflex@bhflex.co.kr | R&D inquiry : technology@bhflex.co.kr | BH Cyber Shinmungo : bhjebo@naver.com
Copyright 2017 bhflex Co. Ltd. ALL RIGHTS RESERVED
25, Pyeongcheon-ro 199beon-gil, Bupyeong-gu, Incheon (Cheongcheon-dong)
TEL : 032.510.2000
FAX : 032-514-8677 | E-mail : bhflex@bhflex.co.kr
R&D inquiry : technology@bhflex.co.kr
BH Cyber Shinmungo : bhjebo@naver.com
