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About Us

About Group Companies

Business description

R&D

Investment information

ESG management

Recruitment information

R&D

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Technology

Technology

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Technology

Technology Roadmap

''BH, a leading R&D organization preparing for the future,
is leading the creation of new values through ceaseless efforts and investments.'

BH's R&D researchers are specialized in new product development/mass production with their leading technology,,
and strive to improve BH's products and services.

Via Hole
Technology

Fine Pattern
Technology

Surface Insulation
Technology

ACF Reliability

Development of automatic punching machine

Landless
Technology

Micro LED
Technology

Stretchable FPCB
Technology

Via Hole Technology
  • Realization of high integration of wiring, minimization of signal loss, and improvement of thermal reliability through various interlayer conduction technology
  • Able to propose customized technology for each product group
Normal
Mechanical Drill Normal Plating Laser Via hole Normal Plating Laser Via & Via on Via Via Fill Plating
  • Hole Size
    -. Min : 0.1Φ
  • Aspect Ratio
    -. 1 : 4 ▼
  • Hole Size
    -. Min : 0.08Φ
  • Aspect Ratio
    -. 85% ▼
  • Hole Size
    -. Min : 0.1Φ
  • Aspect Ratio
    -. 85% ▼
Special
Though Hole Via Filling Ultra Micro Via Normal & Via Filling
  • Hole Size
    -. Min : 0.08 ~ 0.15Φ
  • Aspect Ratio
    -. 1 : 1 ~3 內
  • Hole Size
    -. Min : 0.025Φ ~ 0.050Φ
  • Aspect Ratio
    -. 1 : 2.5 ▼
Normal
Mechanical Drill Normal Plating
  • Hole Size
    -. Min : 0.1Φ
  • Aspect Ratio
    -. 1 : 4 ▼
Laser Via hole Normal Plating
  • Hole Size
    -. Min : 0.08Φ
  • Aspect Ratio
    -. 85% ▼
Laser Via & Via on Via Via Fill Plating
  • Hole Size
    -. Min : 0.1Φ
  • Aspect Ratio
    -. 85% ▼
Special
Though Hole Via Filling
  • Hole Size
    -. Min : 0.08 ~ 0.15Φ
  • Aspect Ratio
    -. 1 : 1 ~3 內
Ultra Micro Via Normal & Via Filling
  • Hole Size
    -. Min : 0.025Φ ~ 0.050Φ
  • Aspect Ratio
    -. 1 : 2.5 ▼

※ Aspect Ratio

Fine Pattern Technology
  • Implementation of Fine Pattern according to high functionality needs
  • Light, thin, short and small due to increased design freedom
Mass production level

[ Tenting (Etching Process) ]
  • Technology to improve adhesion and overcome gaps
  • Improved ability to implement new LDI → Fine circuits
  • Orthogonal etchant & concentration optimization → increase in E/T Factor
  • Vacuum Etching & Twin-Fluid Etching → Increase in E/T Balance
R&D

[ mSAP ( Modified Semi-additive Process) ]

  • Able to realize fine circuit (35um↓) without lowering the metal thickness
  • Able to secure wiring copper plating thickness of 18um
  • Able to realize low wiring resistance
  • Implementation of high etch factor (Min. 5↑ )
Surface Insulation Technology
  • Development of solder mask and insulation surface finishing method
  • Able to implement high-flatness
  • Improved solderability and wire bondability
  • Main applications: Camera module, Sensor mounting application.
ACF Reliability
  • ACF tension → Parameter optimization/ quality assurance system
  • ACF (OLB) terminal elongation optimization → ±0.05mm (cpk 1.33 ▲)
  • RTR/sheet input scale optimization → minimization scale deviation for each facility
ACF Bonder / PEEL / Plasma Elongation management
ACF Bonder / PEEL / Plasma
Elongation management
Development of automatic punching machine
  • Automatic input + sorting + automatic punching + discharge automation → defective handling rate ▼
  • Punching + sorting Merge → Open, Short sorting loading
Facility floor plan Facility Flow

Automatic input

Automatic punching

Automatic sorting

Automatic discharge
Facility floor plan
Facility Flow

Automatic input

Automatic punching

Automatic sorting

Automatic discharge
Landless Technology
  • Able to implement landless through reduction of hole annual ring in addition to Ultra Micro Via Hole technology
  • R&D Technology: Implementation of Annual Ring ±25um
  • Landless Effect: Improved design freedom
Mass production level
Land 300㎛
Via 100㎛
Mass production level
Land 75㎛
Via 25㎛
BH R&D Technology : Landless FPC
Micro LED Technology
  • Development of Micro LED to express complete black color, which is difficult to implement in the existing Back Light LCD Display → Existing LCD Backlight LCD Displays have a phenomenon in which light appears to be spread due to backlight interference nearby
  • Micro LED Design & BH FPCB Technology
Classification Fine Pattern Min Line/Space(um) Small Via & Pad Annual Ring(um) SR Tolerance Eccentric Tolerance (um) a lot of Via Hole Number of Holes (EA/sqm)
Normal Application 45/45 100 40 10~30만
Micro LED 35/35↓ 30↓ 20 100↑
ETC
Classification Fine Pattern Min Line/Space(um) Small Via & Pad Annual Ring(um)
Normal Application 45/45 100
Micro LED 35/35↓ 30↓
ETC
Classification SR Tolerance Eccentric Tolerance (um) a lot of Via Hole Number of Holes (EA/sqm)
Normal Application 40 10~30만
Micro LED 20 100↑
ETC
Stretchable FPCB Technology
  • Development of Stretchable FPCB capable of mechanical wiring such as curved surfaces or spheres
  • Applicable to products requiring repetition and extension
  • Able to suppress disconnection due to increased resistance caused by stretching and deformation / increased fatigue strength
Stretchable Test