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Technology Roadmap

Technology Roadmap

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보유기술

Technology Roadmap

Pattern Technology
  • A / B : Line / space (um)
  • H 1 : Base Copper Thickness (um)
  • H 2 : Base Copper + Cu Plating Thickness (um)
(Unit : ㎛ )
Pattern Pitch
( Line/ Space )		 Cu Thickness Double side Multi & Rigid Flex
No Plating ( No Via ) Cu Thickness & Pattern width
Method Cu Thickness 21um
9㎛ 12㎛
2023 Etching 25/30 30/30 40/50
2024 Etching 20/25 25/30 40/50
mSAP - 25/25 35/35
2025 Etching 20/25 20/30 35/45
mSAP - 20/20 25/30
Via Hole Technology
  • C : PSR ink dam
  • D : Metal & PSR dam Space
  • E : BGA pitch
  • E’ : BGA pad Size ( um )
  • F : Mechanical drill hole
  • G : Mechanical drill pad (Outer land / Inner land)
  • H : Micro via hole ( um )
  • I : Micro via target pad ( um )
  • J : Micro via capture pad ( um )
(Unit : ㎛ )
Via Hole & PAD
( Via Size / PAD Size)		 2023 2024 2025
Double side
(Cu/PI/Cu=12/20/12)		 Laser Drill Blind Hole 100/250 75/235 70/220
Through Hole 75/250 50/220 35/200
Mechanical Drill Through Hole 100/280 90/260 80/250
Multi & RF Laser Drill Blind Hole 100/250 90/240 85/240
Mechanical Drill Through Hole 100/280 90/270 90/250
자재에 대한 기술력
Unit :mm
Time Frame 2023 2024 2025 Note
D
e
s
i
g
n		 BGA Ball Pitch 0.50 0.45 0.40
Tolerance Pattern & Via Annual Ring ±0.075 ±0.070 ±0.060 Double Side
Solder mask Resist Solder mask Resist ±0.040 ±0.030 ±0.020
Dielectric Thickness PI Film Polyimide 0.0075 0.0075 0.0050 Minimum
Adhesive 0.015 0.013 0.01 Minimum
Adhesive Bonding Sheet 0.015 0.01 0.01 Minimum
Prepreg 0.04 0.035 0.030
M
a
t
e
r
i
a
l
s		 RF Stack up ( Rigid / Flex ↓) 12L / 4L↓ 14L / 2L↓ 16L / 2L↓
Low Dk (PI / PrePreg / Bonding) 3.2/3.7/2.7 3.6/ 2.9/2.35 ←
Low Df (PI / PrePreg / Bonding) 0.005/0.017/0.0159 0.0025/0.0025/0.0026 ←