(주)비에이치

R&D 소개

Technology Roadmap

Time Frame		2026	2027	2028
Build	Layer	14L	16L	18L
Pattern	Line/Space (µm)	30/35	30/30	30/30
	Impedance Tolerance (%)	±10	±8	±8
	BGA Pitch (µm)	370	350	300
Via / Land	Through Hole (µm)	80/240	80/240	80/230
Via / Land	Blind Via Hole (µm)	80/210	75/195	75/170
Solder Mask	Registration Tolerance (µm)	±35	±30	±25
Materials	Pi Thickness(CCL)	5.0µm	-	-
	Bonding Thickness	10µm	-	-
	Prepreg Thickness	25µm	25µm	23µm
	Low Dk (Pi / Bonding)	3.2 / 2.3	3.1 / 2.0	3.0 / 2.0
	Low Df (Pi / Bonding)	0.0022 / 0.0025	0.0020 / 0.0025	0.0020 / 0.0020
	EMI SHIELD	80dB	80dB ↑	80dB ↑

Time Frame		2026	2027	2028
Build	Layer	16L	18L	20L
Pattern	Line/Space (µm)	40/50	35/40	30/40
	Impedance Tolerance (%)	±10	±8	±5
	BGA Pitch (µm)	400	350	350
Via / Land	Through Hole (µm)	150/330	150/310	100/250
Via / Land	Blind Via Hole (µm)	85/185	75/155	65/125
Solder Mask	Registration Tolerance (µm)	±25	±25	±20
Materials	Min. Core Thickness (µm)	48µm	40µm	40µm
	Min. Prepreg Thickness (µm)	27µm	25µm	23µm
	Low Dk / Df	3.5 / 0.007	3.3 / 0.003	3.3 / 0.002